Qualcomm Internship 2024 | Interim Engineering Intern- HW – Apply Now!

Qualcomm Internship 2024 for Interim Engineering Intern- HW Role. Interested Candidates can go through the details and apply using the link provided at the bottom of the Post.

Qualcomm Internship 2024 – Interim Engineering Intern- HW

Company name	Qualcomm
Website	www.Qualcomm.com
Job Role	Interim Engineering Intern- HW
Work Location	Hyderabad, Telangana, India
Job Type	Intern
Experience	Entry Level
Qualification	Master’s or Bachelor’s degree in Electrical Engineering, VLSI, Embedded Systems, VLSI, or ECE
Batch	Not Mentioned
Package	30 – 50k Per Month(Estimated)

Job Description

Qualcomm Internship 2024 – Interim Engineering Intern- HW

General Summary:

Our employees’ ideas drive global innovation. For over thirty years, we have led the mobile technology sector, consistently pushing the limits of what can be achieved. Collaborating with clients across various industries—including automotive, healthcare, smart cities, and robotics—we continue to advance innovation and explore new possibilities in our interconnected world. Joining our team at Qualcomm means you can help shape the future faster.

Areas of Expertise

• SOC & Hard Macro Physical Design
• SOC Validation & Debug
• RF & Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineering
• Design for Test (DFT)
• CPU Design

Required Educational Background and Skills

Candidates should have a background in one or more of the following:

• Verification of SoCs with embedded RISC/DSP processors and communication/networking ASICs
• Proficiency in Verilog or VHDL, C/C++, Tcl/Perl/shell scripting, RTL design experience, or strong object-oriented programming skills
• Knowledge of wireless/wired communications and protocols or graphics/video multimedia
• Understanding of PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or layout in RF/Analog/Mixed Signal IC Design
• Strong analytical and problem-solving abilities
• Effective teamwork and collaboration skills
• Proficient verbal and written communication skills

Educational Qualifications

• Master’s or Bachelor’s degree in Electrical Engineering, VLSI, Embedded Systems, VLSI, or ECE

CGI Hiring Computer Science Freshers – Apply Now!

Qualcomm Internship 2024 – Software Engineering Intern – Summer 2024

Company name	Qualcomm
Website	www.Qualcomm.com
Job Role	Software Engineering Intern – Summer 2024
Work Location	Hyderabad, Telangana, India
Job Type	Intern
Experience	Entry Level
Qualification	Masters, Bachelors: Computer Science Engineering, Communication Engineering, ECE,
Batch	2025
Package	30 – 50k Per Month(Estimated)

Job Description – Software Engineering Intern – Summer 2024

• Position Description:
  • Design and develop software for Qualcomm’s mobile chipsets utilizing advanced technology.
  • Qualcomm seeks dynamic, creative, and self-motivated engineers for various multimedia and wireless technologies, including:
    • Multimedia Technologies: Audio and Video codecs, Image Processing.
    • Wireless Modem Technologies: 4G, WiFi, Bluetooth, Self-Organizing Networks.
    • Platform Level SW: Linux, Android, Windows, Board Support Packages.
    • IoT Technologies: Connected Cameras, Smart Assistants, Drones, Virtual Reality, Augmented Reality.
• Required Educational Background:
  • Proficiency in one or more of the following areas:
    • Real-time embedded software and device driver development.
    • Mobile software development for Windows Mobile, Android, or Linux.
    • Strong grasp of OS concepts, Data structures, etc.
    • Proficiency in C/C++ and object-oriented design.
    • Familiarity with wireless network standards like CDMA/GSM/UMTS/LTE.
    • Experience with Linux/UNIX, Linux Drivers, Linux Kernel Development.
    • Understanding of protocols such as TCP/UDP/IP/SIP/RTP, etc.
    • Knowledge of multimedia technologies including Audio, Video, Imaging.
    • Excellent analytical and problem-solving skills.
    • Ability to collaborate effectively in teams.
    • Strong verbal and written communication skills.
• Opportunities:
  • SW development for Android, Windows Mobile-based Embedded Platforms.
  • Development of multimedia software stack, firmware, and drivers.
  • Software and Firmware Development for Wireless Modems and connectivity.
  • Development of communication protocol stack software.
  • Kernel, BSP, and Device Driver Development.
  • Application software and UI development.
  • Software Architecture for embedded devices based on Android, Windows.
  • Design and development based on Object-oriented programming principles.
• Education Requirements:
  • Masters or Bachelors in Computer Science Engineering, Communication Engineering, or ECE.
  • Expected graduation in 2025.

Qualcomm Internship 2024 – Hardware Engineering Intern – Summer 2024

Company name	Qualcomm
Website	www.Qualcomm.com
Job Role	Hardware Engineering Intern – Summer 2024
Work Location	Hyderabad, Telangana, India
Job Type	Intern
Experience	Entry Level
Qualification	Bachelor’s or Master’s degree in Electrical Engineering, VLSI, Embedded and VLSI, or ECE.
Batch	2024
Package	30 – 50k Per Month(Estimated)

Job Description – Hardware Engineering Intern – Summer 2024

Our organization values the transformative impact of our employees’ ideas on the world. For over thirty years, we have maintained a leading position in the global mobile technology sector, consistently pushing the boundaries of innovation. Collaborating with clients across various industries, including automotive, healthcare, smart cities, and robotics, we continuously drive progress and explore new opportunities in an era defined by interconnectedness. By becoming a part of our team at Qualcomm, you will play a vital role in propelling the future forward at an accelerated pace.

Position Requirements:

1. SOC & Hard Macro Physical Design
2. SOC Validation & Debugging
3. RF & Analog Layout
4. RF/Analog/Mixed Signal/Power IC Design
5. Low Power Design
6. Board and FPGA Design
7. Digital ASIC Design
8. Design/SOC Verification
9. CAD Solution Engineering
10. Design for Test (DFT)
11. CPU Design

Preferred Educational Background:

• Specialization in one or more of the following areas:
  • Verification of SoC with embedded RISC/DSP processors, communications/networking ASICs.
  • Proficiency in Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting, RTL design, and/or strong object-oriented programming skills.
  • Familiarity with wireless/wired communications and protocols, or graphics/video multi-media.
  • Knowledge of PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout in RF/Analog/Mixed Signal IC Design.

Skills and Qualifications:

• Exceptional analytical and problem-solving abilities.
• Proficiency in collaboration and teamwork.
• Strong verbal and written communication skills.

Educational Requirements:

• Bachelor’s or Master’s degree in Electrical Engineering, VLSI, Embedded and VLSI, or ECE.
• Expected graduation in 2024.

About Qualcomm

Qualcomm is a leading investment platform that has gained significant popularity in recent years. Founded with the mission to democratize investment opportunities for the masses, Groww provides a user-friendly and intuitive platform for individuals to invest in various financial instruments, including mutual funds, stocks, and gold. With a seamless and hassle-free onboarding process, users can start their investment journey with ease. Groww’s emphasis on simplicity, transparency, and education has made it a preferred choice for both seasoned investors and beginners looking to explore the world of investments. The platform offers a wide range of investment options, detailed information on funds and stocks, and tools to track and manage investments effectively. Groww has successfully bridged the gap between technology and finance, empowering individuals to take control of their financial future.